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3M Receives Lexmark Prestige Supplier Certification for Flexible Circuits

16 Apr, 2002

3M Receives Lexmark Prestige Supplier Certification for Flexible Circuits

AUSTIN, Texas--(BUSINESS WIRE)--April 16, 2002--3M Microinterconnect Systems Division has been awarded the Prestige Supplier Certification from the Consumer Printer Division of Lexmark International, Inc. 3M is a long-time supplier of Microflex circuits for Lexmark's inkjet printhead cartridge operations worldwide. The single-metal layer flexible circuits, supplied with and without covercoat, are produced in high volumes in reel-to-reel format.

To achieve Prestige certification, which requires a minimum of 4.5 Sigma quality levels, 3M had to provide ongoing statistical process control data on several critical aspects of the circuits, pass a series of quality audits, meet 100 percent on-time delivery requirements and meet stringent cost requirements.


James Woolley, division vice president, 3M Microinterconnect Systems Division, said, "Our focus on achieving operational excellence through the use of Six Sigma methodology and on total customer satisfaction has enabled us to meet Lexmark's stringent requirements for supplier performance at this level. We actually exceeded the requirements in several areas and have now set our sites on achieving Lexmark's World Class certification, which is equivalent to providing Six Sigma quality."


3M has been supplying high-volume production parts to Lexmark since 1993.

Lexmark International is a leading developer, manufacturer and supplier of printing solutions - including laser and inkjet printers, associated supplies and services - for offices and homes in more than 150 countries.


3M Microinterconnect Systems Division provides custom, high-performance flexible circuits for today's demanding electronics applications, including inkjet printers, hard disk drives, optoelectronics, liquid crystal displays, medical, bioanalytical, IC packaging and other fine-pitch interconnect applications. 3M's technology, materials and process expertise enable its offering of circuits with one- and two-metal layer construction, and liquid crystal polymer or polyimide substrates. The division also supplies high density multilayer interconnect solutions for electronics and photonics packaging. These high-density laminated chip packages provide breakthrough density and outstanding electrical performance optimized for ASICs in high bandwidth and networking applications.

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