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UMC and Ricoh Broaden Long-term Manufacturing Partnership

13 May, 2002

UMC and Ricoh Broaden Long-term Manufacturing Partnership

UMC, a leading semiconductor foundry, announced the development of a highly specialized ASIC for Ricoh Company Ltd. The IC, built for imaging processing equipment, it is based on UMC's 130nm copper/low-k technology with mass production for the chip expected in August. Ricoh's successful migration to UMC's 130nm process generation signifies Ricoh's status as Japan's leading provider of products that utilize the industry's most advanced technology. UMC has been producing 180nm products for Ricoh since May 2001.


Dr. Terumoto Nonaka, president of Ricoh Electronic Device Company, commented, "Although Ricoh operates its own manufacturing facilities, our latest generation of advanced products requires the industry's most cutting-edge process technologies. UMC is the perfect choice for Ricoh's advanced products as it continues to prove its ability to deliver leading technologies such as its 130nm process capability."


UMC provided supporting design services including 130nm libraries, IP resources, and integrated design rules to facilitate smoother design-in, while Ricoh shared its product data and worked together with UMC engineers to achieve first silicon success.


Dr. Terumoto Nonaka added, "We have been working with UMC for quite some time for our 180nm based products and are pleased to be able to make the successful migration to 130nm. We also expect to extend our existing and future product manufacturing to UMC's other worldwide production facilities, creating a win-win situation for both our companies through a more diversified manufacturing base."

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